RC circuit model for multi-walled carbon nanotubes

Author

Nieuwoudt, Arthur ; Massoud, Yehia

Author_Institution

Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX

fYear

2007

fDate

2-5 Aug. 2007

Firstpage

660

Lastpage

663

Abstract

To alleviate the problems associated with current copper interconnect technology, multi-walled carbon nanotubes (MWCNTs) have been proposed as a potential solution for on-chip communication in VLSI applications. In this paper, we develop an equivalent RC circuit model for MWCNT interconnect that captures both DC conductance and high frequency impedance due to capacitive effects. Based on the circuit model, we find that MWCNT-based interconnect can have substantially less delay than copper wires in global interconnect applications.

Keywords

RC circuits; VLSI; carbon nanotubes; copper; electrical resistivity; integrated circuit interconnections; semiconductor device models; C; Cu; DC conductance; MWCNT interconnect; RC circuit model; VLSI applications; copper wires; current copper interconnect technology; global interconnect applications; high-frequency impedance; multiwalled carbon nanotubes; on-chip communication; Carbon nanotubes; Contact resistance; Copper; Delay; Frequency; Impedance; Integrated circuit interconnections; Optical scattering; Very large scale integration; Wires; Carbon nanotubes; multi-walled nanotube; nanotube interconnect;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on

Conference_Location

Hong Kong

Print_ISBN

978-1-4244-0607-4

Electronic_ISBN

978-1-4244-0608-1

Type

conf

DOI

10.1109/NANO.2007.4601276

Filename

4601276