DocumentCode

2605806

Title

Multilevel Substrate Technology and Epoxy Component Attach for Hybrid Fabrication

Author

Redemske, R.F.

Author_Institution

Teledyne Microelectronics, Los Angeles, Ca. 90066

fYear

1975

fDate

27485

Firstpage

224

Lastpage

229

Keywords

Bars; Costs; Dielectric substrates; Fabrication; Ink; Integrated circuit interconnections; Integrated circuit technology; Testing; Thermal stresses; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1975. 13th Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1975.362699

Filename

4208080