Packages and Film Resistors for Hybrid Microcircuits

Resistors: A review of resistor systems, and the processes used to deposit and delineate them, is given. Effects of mechanical, thermal, chemical and electrical stresses are discussed as they relate to accuracy and stability. Failure mechanisms are reviewed. Triming techniques are explored and design limits for the various systems discussed. Parameters of interest such as frequency response, temperature coefficient, voltage coefficient and noise are compared for the various systems. Finally, quality control and screening techniques are discussed as they relate failure mechanisms and package quality and reliability control.