• DocumentCode
    2605898
  • Title

    Modeling FinFETs using non-equilibrium green´s function formalism: Influence of interface-roughness on device characteristics

  • Author

    Khan, H.R. ; Mamaluy, D. ; Vasileska, D.

  • Author_Institution
    Arizona State Univ., Tempe, AZ
  • fYear
    2007
  • fDate
    2-5 Aug. 2007
  • Firstpage
    695
  • Lastpage
    699
  • Abstract
    We utilize a fully quantum mechanical transport simulator based on the Contact Block Reduction (CBR) method to investigate the influence of interface roughness in nanoscale FinFET devices. In this work we treat interface roughness by creating a random deviation at ideal Si/SiO2 interface in real space, and then solving quantum transport problem fully self-consistently with the gates for the resulting device potential. We study the influence of interface roughness on device capacitance, drain current, and gate leakage for different regime of operation. Our simulation results show that gate leakage is significantly affected by surface roughness, even though the average oxide thickness remains approximately the same. On the other hand, the on-current is comparatively less sensitive to the interface roughness for FinFET devices with narrow fin width. Furthermore, we find that interface roughness significantly affects both the intrinsic switching speed and, especially, the cut-off frequency of FinFET with narrow fin thickness.
  • Keywords
    Green´s function methods; MOSFET; SCF calculations; leakage currents; silicon; silicon compounds; surface roughness; FinFETs; Si-SiO2; contact block reduction method; device capacitance; drain current; gate leakage; interface roughness; intrinsic switching speed; nonequilibrium Green´s function formalism; oxide thickness; quantum mechanical transport simulator; self-consistent method; surface roughness; Capacitance; Gate leakage; Leakage current; Logic gates; Silicon; Strontium; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-0607-4
  • Type

    conf

  • DOI
    10.1109/NANO.2007.4601284
  • Filename
    4601284