DocumentCode
2606114
Title
The Effect of Impurities on the Corrosion of Aluminum Metallization
Author
Paulson, W.M. ; Lorigan, R.P.
Author_Institution
Motorola Semiconductor Products Division, 5005 E. McDowell Road, Phoenix, ARizona 85008
fYear
1976
fDate
27851
Firstpage
42
Lastpage
47
Abstract
Surface impurities are an important factor that affects the reliability of semiconductor devices exposed to THB environments. Aluminum metallized specimens were intentionally contaminated with controlled amounts of Na, K, and Cl. Corrosion was observed at both the anode and cathode following THB tests. The corrosion rate was proportional to the log of the impurity concentration. A model is proposed to explain the observed corrosion processes.
Keywords
Aluminum; Anodes; Cathodes; Corrosion; Metallization; Semiconductor device reliability; Semiconductor devices; Semiconductor impurities; Surface contamination; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1976.362720
Filename
4208104
Link To Document