DocumentCode
2606281
Title
Methods for Evaluating Plated-Through-Hole Reliability
Author
Oien, M.A.
Author_Institution
Bell Laboratories, Whippany, New Jersey 07981, (201) 386-3000
fYear
1976
fDate
27851
Firstpage
129
Lastpage
131
Abstract
The principal thermo-mechanical failure modes of a plated-through-hole structure are described and the major factors contributing to such failures are discussed in mechanistic terms. This leads to the development of an improved methodology for evaluating the reliability of plated-through-holes.
Keywords
Capacitive sensors; Circuit testing; Copper; Drilling; Manufacturing; Plastics; Soldering; Strain measurement; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1976.362731
Filename
4208115
Link To Document