• DocumentCode
    2606358
  • Title

    Process Technology - Interconnect & 3D-IC´s

  • Author

    Iacoponi, John ; Hasegawa, Toshiaki

  • Author_Institution
    AMD
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    967
  • Lastpage
    967
  • Keywords
    Copper; Costs; Dielectrics; Hafnium oxide; MIM capacitors; Microassembly; National electric code; Packaging; Paper technology; Three-dimensional integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2007. IEDM 2007. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-1507-6
  • Electronic_ISBN
    978-1-4244-1508-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2007.4419114
  • Filename
    4419114
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2606358