Basic Integrated Circuit Failure Analysis Techniques

This tutorial is a review of several basic analytical techniques used to perform failure analysis on integrated circuits. Included are methods for failure verification, package opening, and electrical die probing. "Secrets" for obtaining ac measurements above 1MHz are discussed along with techniques of microsurgery for isolation of integrated components. A detailed presentation of the metallurgical technique of angle lapping is included along with an error correction scheme to aid in precise junction depth measurements. Chemical formulas for staining silicon and selectively removing silicon oxides and metallization are revealed.