• DocumentCode
    2606633
  • Title

    Microcircuit Package Gas Analysis

  • Author

    Thomas, Robert W.

  • Author_Institution
    ROME AIR DEVELOPMENT CENTER, GRIFFISS AFB NY 13441. (315)330-4632
  • fYear
    1976
  • fDate
    27851
  • Firstpage
    283
  • Lastpage
    294
  • Abstract
    A method for accurately measuring the ambient gas hermetically sealed within the cavity of micro-electronic package is described. Design consideration for the opening chamber are discussed. The type of mass spectrometer and its operation are detailed for those who might be selecting one as a detector. Finally, the pumping system and an automated data analysis system are considered in detail. Once assembled, the gas analysis system must be accurately calibrated. The various methods used for calibration are discussed, followed by section which relates the analysis results to the assembly and sealing of the microcircuit package.
  • Keywords
    Assembly systems; Circuits; Electronics packaging; Information analysis; Mass spectroscopy; Moisture; Steel; Temperature; Vacuum systems; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1976. 14th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1976.362755
  • Filename
    4208139