DocumentCode
2606633
Title
Microcircuit Package Gas Analysis
Author
Thomas, Robert W.
Author_Institution
ROME AIR DEVELOPMENT CENTER, GRIFFISS AFB NY 13441. (315)330-4632
fYear
1976
fDate
27851
Firstpage
283
Lastpage
294
Abstract
A method for accurately measuring the ambient gas hermetically sealed within the cavity of micro-electronic package is described. Design consideration for the opening chamber are discussed. The type of mass spectrometer and its operation are detailed for those who might be selecting one as a detector. Finally, the pumping system and an automated data analysis system are considered in detail. Once assembled, the gas analysis system must be accurately calibrated. The various methods used for calibration are discussed, followed by section which relates the analysis results to the assembly and sealing of the microcircuit package.
Keywords
Assembly systems; Circuits; Electronics packaging; Information analysis; Mass spectroscopy; Moisture; Steel; Temperature; Vacuum systems; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1976.362755
Filename
4208139
Link To Document