2.4 GHz Bluetooth module with integral passives in multi-dielectric layer printed-circuit boards

The motivation to further miniaturize and reduce the cost of portable electric devices has recently focused on the task of integration of the passive functions. In this paper, implications for integrating inductors and capacitors with standard multi-layer printed wiring board (PWB) lamination processes on organic substrates is discussed. To improve the circuit performance and obtain greater benefits of the integral passives, a multi-dielectric substrate with layer-specific dielectric constant and thickness is used to fulfill the designing of various integral passives. With these different material characteristics, we extract electrical parameters such as dielectric constant and loss tangent versus frequency of the special materials and then design various integral passives in a 6-layer multi-dielectric PWB substrate. Finally the potential advantages of using the PWB process on organic substrate with integral passives for a Bluetooth (BT) module are demonstrated.