DocumentCode
2607050
Title
Direct high frequency measurement method for small diameter coaxial cable
Author
Aoyagi, Masahiro ; Tanaka, Seiji ; Kikuchi, Katsuya ; Unno, Taiju ; Watanabe, Kazunori ; Matsuno, Shigehiro ; Tokoro, Kazuhiko ; Nakagawa, Hiroshi
Author_Institution
NeRl, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
fYear
2003
fDate
10-12 Dec. 2003
Firstpage
164
Lastpage
167
Abstract
We are developing a high-quality flexible coaxial cable with a diameter of less than 1 mm. It is difficult to carry out precise measurement using the conventional coaxial connectors that are commercially available. Therefore, we have developed a high frequency measurement method for determining the characteristics of a small-diameter coaxial cable without exclusive connectors. In this method, a time domain reflectometry (TDR) measurement system and a microwave vector network analyzer (VNA) are used with a microwave probe station. The cables are molded using resin and cut vertically with a cutting tool. The surfaces of the cable edges are polished to obtain a good electrical contact. Microwave contact probes (SG or GS type) are used. We have precisely measured the characteristics of 0.8-mm-diameter coaxial cables. The impedance distribution and S parameters were successfully evaluated by TDR and VNA measurement respectively. The impedance distortion at the probe contact was negligible. The effects of the connection performance are discussed in detail.
Keywords
S-parameters; coaxial cables; electric impedance measurement; microwave reflectometry; network analysers; time-domain reflectometry; 0.8 mm; S-parameters; connection performance; direct high frequency measurement method; high-quality flexible coaxial cable; impedance distribution; microwave probe station; microwave vector network analyzer; small diameter coaxial cables; time domain reflectometry measurement system; Coaxial cables; Coaxial components; Connectors; Contacts; Distortion measurement; Frequency measurement; Microwave theory and techniques; Probes; Surface impedance; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN
0-7803-8205-6
Type
conf
DOI
10.1109/EPTC.2003.1271509
Filename
1271509
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