DocumentCode
2607053
Title
Effects of Burn-In and Temperature Cycling on the Corrosion Resistance of Plastic Encapsulated Integrated Circuits
Author
Bailey, C.M.
Author_Institution
Bell Telephone Laboratories, 555 Union Boulevard, Allentown, Pennsylvania 18103. (215) 439-6140
fYear
1977
fDate
28216
Firstpage
120
Lastpage
124
Abstract
Plastic-encapsulated integrated circuits are susceptible to failures due to moisture-related corrosion of aluminum metallization. A test program has been conducted to evaluate the possible effects of 100% burn-in and temperature cycling device screens in increasing that susceptibility. Results indicate no significant effects.
Keywords
Aluminum; Bonding; Circuit testing; Corrosion; Glass; Integrated circuit metallization; Moisture; Packaging; Plastics; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location
LAs Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1977.362781
Filename
4208168
Link To Document