Title :
SPICE-compatible full-wave equivalent circuit model for interconnect structures
Author :
See, K.Y. ; Chua, E.K.
Author_Institution :
Nanyang Technol. Univ., Singapore, Singapore
Abstract :
This paper presents the development of a SPICE-compatible fall-wave equivalent circuit model for high-speed interconnect structures. By enforcing the necessary boundary conditions for the Maxwell´s equations on the interconnect structures, the electric field integral equations (EFIEs) are formulated. Using the method of moments, the inductive and capacitive elements of the interconnect structure are extracted. Good agreement with the results obtained from an EM simulator is demonstrated.
Keywords :
Maxwell equations; SPICE; computational electromagnetics; electric field integral equations; equivalent circuits; interconnections; method of moments; network analysis; EFIE; EM simulator; Maxwell equation boundary conditions; SPICE-compatible circuit model; electric field integral equations; full-wave equivalent circuit model; high-speed interconnect structure modeling; interconnect structure capacitive elements; interconnect structure inductive elements; method of moments; Capacitance; Circuit simulation; Conductors; Current distribution; Electric potential; Equivalent circuits; Integral equations; Integrated circuit interconnections; Moment methods; SPICE;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271510