SPICE-compatible full-wave equivalent circuit model for interconnect structures

Author

See, K.Y. ; Chua, E.K.

Author_Institution

Nanyang Technol. Univ., Singapore, Singapore

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

168

Lastpage

170

Abstract

This paper presents the development of a SPICE-compatible fall-wave equivalent circuit model for high-speed interconnect structures. By enforcing the necessary boundary conditions for the Maxwell´s equations on the interconnect structures, the electric field integral equations (EFIEs) are formulated. Using the method of moments, the inductive and capacitive elements of the interconnect structure are extracted. Good agreement with the results obtained from an EM simulator is demonstrated.

Keywords

Maxwell equations; SPICE; computational electromagnetics; electric field integral equations; equivalent circuits; interconnections; method of moments; network analysis; EFIE; EM simulator; Maxwell equation boundary conditions; SPICE-compatible circuit model; electric field integral equations; full-wave equivalent circuit model; high-speed interconnect structure modeling; interconnect structure capacitive elements; interconnect structure inductive elements; method of moments; Capacitance; Circuit simulation; Conductors; Current distribution; Electric potential; Equivalent circuits; Integral equations; Integrated circuit interconnections; Moment methods; SPICE;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271510

Filename

1271510