DocumentCode
2607275
Title
Fabrication of micro temperature sensor on the flexible substrate
Author
Lee, Chi-Yuan ; Lee, Shuo-Jen ; Wu, Guan-Wei
Author_Institution
Dept. of Mech. Eng., Yuan Ze Univ., Taoyuan
fYear
2007
fDate
2-5 Aug. 2007
Firstpage
1050
Lastpage
1053
Abstract
In this study, micro flexible temperature sensor arrays were designed and fabricated on parylene thin film. The flexible parylene thin film was inserted into the micro temperature sensors using the micro-electro-mechanical-systems (MEMS) fabrication process. The flexible micro sensor array was covered with two pieces of parylene thin film that was etched by reactive ion etching (RIE) to uncover the contact pad. Finally, the silicon wafer was segmented and then soaked in acetone to remove the flexible temperature sensor from the silicon substrate. In fabricating the thin films, Au and Cr resistive temperature sensor arrays with Al conducting lines, the Cr was formed the adhesion layer between parylene and Au. The thickness of parylene and the micro temperature sensor was 2 mum. They could therefore be easily attached to curved surfaces. The thin film sensors were highly sensitive (4.44times10-3/degC) to temperature and were effective at temperatures of up to 100degC. This study verified the feasibility of thin film sensor array applications with flexible parylene-base.
Keywords
aluminium; chromium; gold; metallic thin films; microsensors; polymer films; sensor arrays; sputter etching; temperature sensors; thin film sensors; adhesion layer; micro flexible temperature sensor arrays; micro-electro-mechanical-systems; parylene thin film; reactive ion etching; resistive temperature sensor arrays; silicon wafer; size 2 mum; thin film sensors; Chromium; Etching; Fabrication; Gold; Micromechanical devices; Sensor arrays; Silicon; Substrates; Temperature sensors; Thin film sensors; MEMS; RIE; flexible sensor; parylene-based;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-0607-4
Electronic_ISBN
978-1-4244-0608-1
Type
conf
DOI
10.1109/NANO.2007.4601363
Filename
4601363
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