• DocumentCode
    2607275
  • Title

    Fabrication of micro temperature sensor on the flexible substrate

  • Author

    Lee, Chi-Yuan ; Lee, Shuo-Jen ; Wu, Guan-Wei

  • Author_Institution
    Dept. of Mech. Eng., Yuan Ze Univ., Taoyuan
  • fYear
    2007
  • fDate
    2-5 Aug. 2007
  • Firstpage
    1050
  • Lastpage
    1053
  • Abstract
    In this study, micro flexible temperature sensor arrays were designed and fabricated on parylene thin film. The flexible parylene thin film was inserted into the micro temperature sensors using the micro-electro-mechanical-systems (MEMS) fabrication process. The flexible micro sensor array was covered with two pieces of parylene thin film that was etched by reactive ion etching (RIE) to uncover the contact pad. Finally, the silicon wafer was segmented and then soaked in acetone to remove the flexible temperature sensor from the silicon substrate. In fabricating the thin films, Au and Cr resistive temperature sensor arrays with Al conducting lines, the Cr was formed the adhesion layer between parylene and Au. The thickness of parylene and the micro temperature sensor was 2 mum. They could therefore be easily attached to curved surfaces. The thin film sensors were highly sensitive (4.44times10-3/degC) to temperature and were effective at temperatures of up to 100degC. This study verified the feasibility of thin film sensor array applications with flexible parylene-base.
  • Keywords
    aluminium; chromium; gold; metallic thin films; microsensors; polymer films; sensor arrays; sputter etching; temperature sensors; thin film sensors; adhesion layer; micro flexible temperature sensor arrays; micro-electro-mechanical-systems; parylene thin film; reactive ion etching; resistive temperature sensor arrays; silicon wafer; size 2 mum; thin film sensors; Chromium; Etching; Fabrication; Gold; Micromechanical devices; Sensor arrays; Silicon; Substrates; Temperature sensors; Thin film sensors; MEMS; RIE; flexible sensor; parylene-based;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-0607-4
  • Electronic_ISBN
    978-1-4244-0608-1
  • Type

    conf

  • DOI
    10.1109/NANO.2007.4601363
  • Filename
    4601363