• DocumentCode
    2607314
  • Title

    Face recognition based on multi-module singular value features and probabilistic subspaces analysis

  • Author

    Chen, Dengyi ; Cao, Lin

  • Author_Institution
    Dept. of Telecommun. Eng., Beijing Inf. Sci. & Technol. Univ., Beijing, China
  • Volume
    3
  • fYear
    2011
  • fDate
    15-17 Oct. 2011
  • Firstpage
    1508
  • Lastpage
    1512
  • Abstract
    The paper introduces a face recognition method using probabilistic subspaces analysis on multi-module singular value features of face images. Singular value vector of a face image is valid feature for identification. But the recognition rate is low when only one module singular value vector is used for face recognition. To improve the recognition rate, many sub-images are obtained when the face image is divided in different ways, with all singular values of each image used as a new sample vector of the face image. These multi-module singular value vectors include all features of a face image from local to the whole, so more discriminant information for face recognition is obtained. Subsequently, probabilistic subspaces analysis is used under these multi-module singular value vectors. The experimental results demonstrate that the method is obviously superior to corresponding algorithms and the recognition rate is respectively 97.5% and 99.5% in ORL and CAS-PEAL-R1 human face image databases.
  • Keywords
    face recognition; statistical analysis; visual databases; CAS-PEAL-R1 human face image databases; ORL human face image databases; face images; face recognition; multimodule singular value features; multimodule singular value vectors; probabilistic subspaces analysis; Databases; Face; Face recognition; Image recognition; Probabilistic logic; Training; Vectors; face recognition; multi-module; probabilistic subspaces analysis; singular value decomposition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Image and Signal Processing (CISP), 2011 4th International Congress on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-9304-3
  • Type

    conf

  • DOI
    10.1109/CISP.2011.6100445
  • Filename
    6100445