Title :
An intelligent agent-based collaborative workflow for inter-enterprise PCB product design
Author :
Huang, C.J. ; Liao, L.M.
Author_Institution :
Nat. Chin-Yi Univ. of Technol., Taichung
Abstract :
Currently, there is tremendous pressure to design and develop products in a short period of time to reduce time-to-market and project´s life cycle. Researchers often propose workflow management system as a mechanism to facilitate teamwork in a collaborative product development environment. In this paper, we develop an agent-based collaborative workflow platform (ACWP), in which a group of intelligent agents work autonomously and collaboratively to perform workflow tasks and access data from a distributed environment. By the aid of intelligent agents, our system can execute customized workflow tasks for inter-enterprise users based on their individual requests, and conquer the complexity of product design in distributed, heterogeneous platform. The application of multi-agent systems ACWP for collaborative workflow management is investigated through an inter-enterprise PCB product design. ACWP facilitates PCB product design and team interaction in a collaborative but distributed product development environment and moves up the whole performance of design process.
Keywords :
CAD; cooperative systems; distributed processing; groupware; printed circuit design; product life cycle management; team working; time to market; workflow management software; collaborative product development environment; design process; distributed environment; intelligent agent-based collaborative workflow platform; interenterprise PCB product design; product development; project life cycle; teamwork; time-to-market; workflow management system; Collaborative tools; Collaborative work; Industrial engineering; Intelligent agent; Multiagent systems; Process design; Product design; Product development; Teamwork; Workflow management software; PCB design; agent; collaboration; workflow;
Conference_Titel :
Industrial Engineering and Engineering Management, 2007 IEEE International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1529-8
Electronic_ISBN :
978-1-4244-1529-8
DOI :
10.1109/IEEM.2007.4419177