Development of a dynamic test board for FCBGA solder joint reliability assessment in shock & vibration

Author

Hin, Tze Yang ; Keh Shin Beh ; Seetharamu, K.N.

Author_Institution

Assembly Technol. Dev., Intel Technol., Penang, Malaysia

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

256

Lastpage

262

Abstract

A dynamic test board (DTB) is developed for shock and vibration (S&V) test. The test board is used to characterize the solder joint reliability (SJR) of the component corresponding to the specified dynamic test requirements. The dynamic behaviour and properties are investigated in the development of a flip chip ball grid array package (FCBGA). The BGA tested have 1.27, 1.09 and 1.00 mm ball pitches respectively. One of the significant findings is that board strain is correlated with the solder joint failing location. Hence, this paper introduces board strain as a predictor for S&V SJR risk and component strain limit definition in S&V conditions.

Keywords

ball grid arrays; dynamic testing; flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; 1.00 mm; 1.09 mm; 1.27 mm; BGA ball pitch; FCBGA solder joint reliability; board strain; dynamic test; dynamic test board; flip chip ball grid array package; shock testing; solder joint failing location; vibration testing; Capacitive sensors; Electric shock; Electronics packaging; Fingers; Heat sinks; Life estimation; Packaging machines; Soldering; System testing; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271525

Filename

1271525