Title :
Characterization of Reaction Bonded Au and Ag Thick Film Metallizations
Author :
Kossowsky, R. ; Mitchell, J.
Author_Institution :
Westinghouse Research and Development Center, Pittsburgh, Pennsylvania 15235
Abstract :
The morphologies and microstructural characteristics of Al-wire and Au-wire-bonded to reactively-bonded Au and Ag metallization were studied by SEM and microprobe analyses. The mechanisms of wire bonding in each case and-the mechanisms of the metallization to substrate bonding are discussed.
Keywords :
Additives; Adhesives; Bonding; Gold; Hydrogen; Metallization; Substrates; Surface morphology; Thick films; Wire;
Conference_Titel :
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location :
LAs Vegas, NV, USA
DOI :
10.1109/IRPS.1977.362803
