DocumentCode
2607530
Title
The unique dielectric behaviour of nanosilica epoxy composites
Author
Jiang, Kyle ; Cheng, Lihong ; Zheng, Liaoying ; Yao, Zheng ; Li, Guorong ; Yin, Qingrui
Author_Institution
Dept. of Mech. Eng., Birmingham Univ., Birmingham
fYear
2007
fDate
2-5 Aug. 2007
Firstpage
1101
Lastpage
1106
Abstract
Nanofillers in epoxy composites sometimes results in unexpected properties. Presented in this paper are some findings on the dielectric properties of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin incorporated with surface modified nanosilica particles. 20 nm particles were used in the investigation and the results were compared with those of 100 nm silica composite. The composites were examined under infrared spectroscopy and XRD and it was found that the surface modification of the nanoparticles lead to a good hydrophobic property and made particles easier to form bonds with the resin. The measurements of the dielectric properties of the composites showed that by adding low dielectric constant nanosilica particles, the dielectric constants of the composite were notably increased as opposed to a drop as one might expect, while the dielectric losses were lowered. The increase phenomenon in dielectric constant is explained in terms of water molecules existence in the composites produced during the process.
Keywords
X-ray diffraction; dielectric losses; filled polymers; infrared spectra; nanocomposites; nanoparticles; permittivity; DGEBA; SiO2; XRD; dielectric constant; dielectric losses; dielectric properties; diglycidyl ether of bisphenol-A epoxy resin; hydrophobic property; infrared spectroscopy; nanofillers; nanosilica epoxy composites; nanosilica particles; water molecules; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Epoxy resins; Infrared spectra; Loss measurement; Nanoparticles; Silicon compounds; X-ray scattering; composite insulation; dielectric losses; epoxy resin insulator; permittivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-0607-4
Electronic_ISBN
978-1-4244-0608-1
Type
conf
DOI
10.1109/NANO.2007.4601376
Filename
4601376
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