• DocumentCode
    2607826
  • Title

    Some Package Reliability Implications of Current Trends in Large Scale Silicon Integrated Circuits

  • Author

    Anderson, L.K.

  • Author_Institution
    Bell Telephone Laboratories, Inc., Allentown, Pennsylvania 18103. (215) 439-7991
  • fYear
    1978
  • fDate
    28581
  • Firstpage
    121
  • Lastpage
    123
  • Abstract
    Increasing scale of integration has tended to change the focus of integrated circuit packaging from low cost to high electrical and thermal performance and improved reliability. Today´s high-speed, densely-packed LSI chips pose some new packaging reliability challenges. These are explored briefly.
  • Keywords
    Chip scale packaging; Costs; Hazards; Integrated circuit packaging; Integrated circuit reliability; Integrated circuit yield; Large scale integration; Logic; Packaging machines; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1978. 16th Annual
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1978.362832
  • Filename
    4208222
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2607826