• DocumentCode
    2608054
  • Title

    Quantifying world-class using AHP for manufacturing industries

  • Author

    Kodali, Rambabu ; Sharma, Monica

  • Author_Institution
    Birla Inst. of Technol. & Sci. (BITS), Pilani
  • fYear
    2007
  • fDate
    2-4 Dec. 2007
  • Firstpage
    387
  • Lastpage
    391
  • Abstract
    In recent years, there are some organizations, which are considered as world-class manufacturers, while many organizations are in the quest to attain the invincible status of being \´world-class\´. But an important question that has not been addressed yet is: "how to evaluate or assess an organization to deem it as world-class?" There is no literature available currently, which provides a methodology for the same. Hence, in this paper, an attempt has been made to quantify the term \´world-class\´ by identifying various factors/practices that need to be present and followed in world-class organizations. These factors/practices are assessed using a rating scale, which were aggregated and related to the updated list of competitive priorities, namely, morale, flexibility, innovation and social responsibility in addition the traditional priorities such as productivity, cost, quality, and delivery. To accomplish these activities, a Multi- Attribute Decision-Making (MADM) model, namely the Analytic Hierarchy Process (AHP) is used and the steps for the same have been demonstrated.
  • Keywords
    decision making; manufacturing industries; AHP; analytic hierarchy process; manufacturing industries; multiattribute decision-making; world-class organizations; Automobile manufacture; Costs; Decision making; Electronics industry; Manufacturing industries; Manufacturing processes; Mechanical engineering; Productivity; Technological innovation; Toy manufacturing industry; World-class manufacturing; analytic hierarchy process; multi-attribute decision making; world-class;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2007 IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1529-8
  • Electronic_ISBN
    978-1-4244-1529-8
  • Type

    conf

  • DOI
    10.1109/IEEM.2007.4419217
  • Filename
    4419217