Design for reliability (DFR) methodology for electronic packaging assemblies

Author

Pang, John H L ; Low, T.H. ; Xiong, B.S. ; Che, F.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

470

Lastpage

478

Abstract

Design for reliability requires knowledge based in materials testing and modeling, finite element modeling and simulation, failure mechanism and life prediction and reliability tests for validation. A comprehensive mechanics characterization of electronic solders such as Sn/Pb and Pb-free solders has been established. Examples of conventional 2D and 3D Finite Element Analysis is provided for Thermal Cycling analysis of elastic-plastic-creep analysis of solder joints. The combined effect of modeling viscoelastic underfill and viscoplastic solder is reported for thermal cycling (TC) and thermal shock loading (TS). Two global-local modeling techniques for board-level analysis was calibrated. The global-local 3D modeling techniques are global-local submodeling (GLS) and global-local-beam (GLB) methods.

Keywords

Young´s modulus; circuit reliability; creep; fatigue; finite element analysis; lead alloys; life testing; reflow soldering; solders; surface mount technology; tensile strength; thermal management (packaging); thermal shock; tin alloys; viscoelasticity; viscoplasticity; yield stress; SnPb; Young´s modulus; board-level analysis; design for reliability methodology; elastic-plastic-creep analysis; electronic packaging assemblies; electronic solders; failure mechanism; finite element modeling; global-local modeling techniques; global-local submodeling; global-local-beam methods; life prediction; materials modeling; materials testing; reliability tests; solder joints; solder reflow; thermal cycling analysis; thermal shock loading; viscoelastic underfill; viscoplastic solder; yield stress; Assembly; Electronics packaging; Failure analysis; Finite element methods; Life testing; Materials reliability; Materials testing; Predictive models; Thermal loading; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271567

Filename

1271567