Accuracy of turbulence models and CFD for thermal characterisation of electronic systems

Author

Dhinsa, K. ; Bailey, C. ; Pericleous, K.

Author_Institution

Old R. Naval Coll., Univ. of Greenwich, UK

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

507

Lastpage

512

Abstract

A major percentage of the heat emitted from electronic packages can be extracted by air cooling whether by means of natural or forced convection. This flow of air throughout an electronic system and the heat extracted is highly dependable on the nature of turbulence present in the flow field. This paper will discuss results from an investigation into the accuracy of turbulence models to predict air cooling for electronic packages and systems.

Keywords

computational fluid dynamics; cooling; electronic engineering computing; finite volume methods; flow simulation; forced convection; natural convection; temperature distribution; thermal management (packaging); turbulence; CFD; Navier Stokes equations; air cooling; effective viscosity; electronic packages; electronic systems; forced convection; heat transfer simulation; laminar viscosity; local velocity; low Reynolds number turbulence; natural convection; temperature profiles; thermal characterisation; turbulence models; Computational fluid dynamics; Educational institutions; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Fluid dynamics; Fluid flow; Numerical models; Predictive models; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271573

Filename

1271573