DocumentCode :
2608374
Title :
Multi resolution TLM methodology
Author :
Oswal, Tikko ; Seng, Leong Mook ; Leong, Ooi Ban ; Rotaru, Mihai Dragos ; Seng, Yeo Mui
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
530
Lastpage :
532
Abstract :
Initially modelling using Transmission line modelling method required meshes of equal size to model the power planes. However, to model power planes with small features accurately and efficiently multi-resolution power plane modelling is required. Fine meshes will model area where small features are present and coarse meshes will model area where small features are not present. In this paper, an interfacing model is derived for multi-resolution modelling by interfacing meshes of different resolution. The derived model is verified by modelling a test power plane. Results match closely till 12 GHz and peaks and s pattern nicely follow upto 20 GHz when modelled by coarse meshes of dimensions 1 mm by 1 mm and finer meshes.
Keywords :
current distribution; power supply circuits; printed circuit design; transmission line theory; 2D wave propagation equation; coarse meshes; current distribution; fine meshes; interfacing model; multiresolution methodology; power planes; transmission line modelling; Boundary conditions; Coaxial components; Computational modeling; Electronic mail; Energy conservation; Energy resolution; Joining processes; Microelectronics; Power transmission lines; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
Type :
conf
DOI :
10.1109/EPTC.2003.1271578
Filename :
1271578
Link To Document :
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