DocumentCode
2608524
Title
Mechanical properties and microstructure of Ca-doped gold bonding wire
Author
Breach, Christopher D. ; Wulff, F. ; Mhaisalkar, S.G.
fYear
2003
fDate
10-12 Dec. 2003
Firstpage
569
Lastpage
573
Abstract
Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.
Keywords
calcium; crystal microstructure; gold; indentation; integrated circuit interconnections; integrated circuit packaging; lead bonding; tensile testing; transmission electron microscopy; Au; Au:Ca; IC packaging failure; TEM; bonding wire mechanical properties; depth sensing indentation; electrical interconnection; gold rods; microstructure; tensile testing; wire bond strengthening mechanism; Alloying; Bonding; Gold; Grain size; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing processes; Mechanical factors; Microstructure; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN
0-7803-8205-6
Type
conf
DOI
10.1109/EPTC.2003.1271585
Filename
1271585
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