Title :
Mechanical properties and microstructure of Ca-doped gold bonding wire
Author :
Breach, Christopher D. ; Wulff, F. ; Mhaisalkar, S.G.
Abstract :
Gold bonding wire is the most widely used electrical interconnection in semiconductor devices, but wire bonds are also a major source of failure in IC packaging. This paper reports a study of microstructure and mechanical behaviour of 5N pure and doped gold wire and gold rods that were studied by TEM, depth sensing indentation and tensile testing. A possible strengthening mechanism is then proposed.
Keywords :
calcium; crystal microstructure; gold; indentation; integrated circuit interconnections; integrated circuit packaging; lead bonding; tensile testing; transmission electron microscopy; Au; Au:Ca; IC packaging failure; TEM; bonding wire mechanical properties; depth sensing indentation; electrical interconnection; gold rods; microstructure; tensile testing; wire bond strengthening mechanism; Alloying; Bonding; Gold; Grain size; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing processes; Mechanical factors; Microstructure; Wire;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271585
