• DocumentCode
    2608696
  • Title

    Electromigration Depletions in Pb-Sn Films

  • Author

    Di Giacomo, Giulio

  • Author_Institution
    International Business Machines Corporation, P.O. Box 390, Poughkeepsie, New York 12602
  • fYear
    1979
  • fDate
    28946
  • Firstpage
    72
  • Lastpage
    76
  • Abstract
    This paper describes the electromigration depletions observed at 125° to 175°C in Pb-Sn films subjected to various current stress conditions up to 2×104 A/cm2. The total depleted volume grows linearly with time and current density. This linear growth consists of the individual depletion growth multiplied by the number of depletions at any time. Both size and number of depletions grow parabolically.
  • Keywords
    Aluminum; Chromium; Copper; Current density; Electromigration; Glass; Nitrogen; Stress; Testing; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1979. 17th Annual
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1979.362873
  • Filename
    4208266
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2608696