• DocumentCode
    2608929
  • Title

    Modeling the valuation process of silicon intellectual property in the semiconductor industry

  • Author

    Hung, C.L. ; Su, Y.H. ; Cheng, Alfred L -P

  • Author_Institution
    Nat. Chi Nan Univ., Nantou
  • fYear
    2007
  • fDate
    2-4 Dec. 2007
  • Firstpage
    592
  • Lastpage
    596
  • Abstract
    The complexity of IC (integrated circuit) design increases as semiconductor fabrication miniaturizes. Assembly of the reusable basic components of the IC design process has become valuable in accelerating development and marketing of new IC applications. As a result, the idea of SIP (silicon intellectual property) has emerged to meet this demand. The purpose of this paper is to develop a SIP valuation model. However, assessing such intangible assets cost high and have a time-consuming negotiation process to safeguard performance. After intensive interviews with SIP providers, we model a SIP valuation process, which incorporates with quality signals, links to the SIP infomediaries, and augments with the industry dynamics. The results are further suggested to support with Internet SIP malls, which are installed to take the advantages of multimedia interface and real-time archive for facilitating the SIP valuation processes.
  • Keywords
    electronics industry; industrial property; integrated circuit design; Internet SIP malls; SIP valuation model; assembly; industry dynamics; integrated circuit design; multimedia interface; semiconductor fabrication; semiconductor industry; silicon intellectual property; Acceleration; Application specific integrated circuits; Assembly; Cost accounting; Electronics industry; Fabrication; Intellectual property; Process design; Signal processing; Silicon; Contracting; Semiconductor; Silicon Intellectual Property; Valuation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2007 IEEE International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1529-8
  • Electronic_ISBN
    978-1-4244-1529-8
  • Type

    conf

  • DOI
    10.1109/IEEM.2007.4419258
  • Filename
    4419258