DocumentCode :
2608984
Title :
Comparison of two flow analysis software for injection moulding tool design
Author :
Sahputra, Iwan Halim
Author_Institution :
Petra Christian Univ., Surabaya
fYear :
2007
fDate :
2-4 Dec. 2007
Firstpage :
607
Lastpage :
611
Abstract :
Main objective of this paper is to discuss comparison the results of injection moulding process simulation analysis generated by particular software with those obtained in a small-scale industrial process. The samples were produced by ´Dasset´ injection moulding machine at laboratory. Component was modelled using Rhinoceros Computer Aided Design (CAD) software. Simulation analysis was performed using moldflow plastics insight (MPI). Two different positions of gate were selected for simulation to investigate the accuracy of the software. Polyethylene (PE) and high impact polystyrene (HIPS) were selected for analysis and production. Comparison with the samples showed that MPI predict maximum pressure needed to fill the mould cavity accurate. MPI predicted flow path and weld lines graphically those were similar to the machine´s process. SIMPOL does not provide such results. It was not possible to compare with the machine´s result because of the machine´s problem. In addition to these results, MPI generated more simulation analysis report of injection moulding process.
Keywords :
design engineering; injection moulding; machine tools; polymer blends; production engineering computing; Rhinoceros Computer Aided Design software; flow analysis software; high impact polystyrene; injection moulding process simulation analysis; injection moulding tool design; moldflow plastics insight; polyethylene; small-scale industrial process; Analytical models; Computational modeling; Computer industry; Design automation; Injection molding; Laboratories; Performance analysis; Plastics; Software design; Software tools; Comparison Analysis; Injection Moulding; Moldflow; SIMPOL;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Engineering and Engineering Management, 2007 IEEE International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1529-8
Electronic_ISBN :
978-1-4244-1529-8
Type :
conf
DOI :
10.1109/IEEM.2007.4419261
Filename :
4419261
Link To Document :
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