DocumentCode
2609147
Title
Interface reactions in microelectronic solder joints and associated intermetallic compounds: an investigation of their mechanical properties using nanoindentation
Author
Albrecht, H.J. ; Juritza, A. ; Müller, K. ; Müller, W.H. ; Sterthaus, J. ; Villain, J. ; Vogliano, A.
Author_Institution
Siemens AG, Berlin, Germany
fYear
2003
fDate
10-12 Dec. 2003
Firstpage
726
Lastpage
731
Abstract
In this paper we present our results on how nanoindentation can serve for measurement of (local) mechanical properties in microelectronic materials and components. Special attention is paid to the properties of interface regions, i.e., the region of intermetallic bonds. Finally a finite element model is presented in order to simulate the full indentation process.
Keywords
Vickers hardness; Young´s modulus; chemical interdiffusion; elastic moduli measurement; electronics packaging; finite element analysis; hardness testing; indentation; soldering; Vickers tests; Young´s modulus; bonded interfacial regions; finite element model; hardness; interface reactions; intermetallic bonds; intermetallic compounds; mechanical properties; microelectronic solder joints; nanoindentation; Bonding; Copper; Finite element methods; Gold; Intermetallic; Mechanical factors; Microelectronics; Nickel; Soldering; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN
0-7803-8205-6
Type
conf
DOI
10.1109/EPTC.2003.1271613
Filename
1271613
Link To Document