DocumentCode :
2610140
Title :
Moisture Uptake and Release by Plastic Molding Compoundsits Relationship to System Life and Failure Mode
Author :
Dycus, Dale W.
Author_Institution :
MOSTEK CORPORATION, 1215 West Crosby, Carrollton, Texas 75006
fYear :
1980
fDate :
29312
Firstpage :
293
Lastpage :
300
Abstract :
Plastic molding compounds show two major moisture uptake rates, one fast and one slow. The fast rate represents the moisture uptake mechanism that is responsible for moisture dependent failures in epoxy novolac plastics. It is felt that the fast rate represents transport through the organic epoxy matrix by hydrogen bonding. Silicone epoxy shows a much slower rate of moisture uptake after an initial induction period. The moisture dependent failure is therefore controlled by the slower rate in silicone epoxy. The slower rate is thought to be uptake by the silica filler matrix.
Keywords :
Active matrix organic light emitting diodes; Bonding; Electronics packaging; Hydrogen; Moisture control; Plastic packaging; Predictive models; Silicon compounds; Stress; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1980. 18th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1980.362956
Filename :
4208352
Link To Document :
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