DocumentCode :
2610153
Title :
Some Considerations of the Gold-Silicon Die Bond Based on Surface Chemical Analysis
Author :
Hoge, Carl E. ; Thomas, Simon
Author_Institution :
BURROUGHS CORPORATION, TECHNOLOGY CENTER, 16701 WEST BERNARDO DRIVE, SAN DIEGO, CALIFORNIA 92127
fYear :
1980
fDate :
29312
Firstpage :
301
Lastpage :
311
Abstract :
Die bond reliability using gold-silicon eutectic preforms was investigated and related to poor wetting of the integrated circuit and substrate by the alloy melt. Using a Scanning Auger Microprobe (SAM), surface and interfacial structures were analyzed and the conditions for bonding or non-bonding outlined.
Keywords :
Bonding; Chemical analysis; Electric resistance; Gold; Microassembly; Packaging; Preforms; Silicon; Substrates; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1980. 18th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1980.362957
Filename :
4208353
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2610153
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