DocumentCode
2610416
Title
Experimental and Mathematical Determination of Mechanical Strains within Plastic IC Packages and Their Effect on Devices During Environmental Tests
Author
Usell, R.J., Jr. ; Smiley, S.A.
Author_Institution
Burroughs Corporation, Micro Components Organization, 16701 West Bernardo Drive, San Diego, CA 92127
fYear
1981
fDate
29677
Firstpage
65
Lastpage
73
Abstract
Methods to quantify mechanical strains in plastic encapsulated devices (PEDs) are described. Calculations of strain-producing tendencies of encapsulants from material properties and processes are given. Measurements of die strain as a function of encapsulant, processing, and environmental exposure are presented. Possible mechanisms for gap formation between chip and encapsulant during autoclave tests are described.
Keywords
Capacitive sensors; Dielectric materials; Integrated circuit testing; Metallization; Passivation; Plastic integrated circuit packaging; Semiconductor device measurement; Strain measurement; Stress; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1981. 19th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1981.362976
Filename
4208375
Link To Document