Title :
Experimental and Mathematical Determination of Mechanical Strains within Plastic IC Packages and Their Effect on Devices During Environmental Tests
Author :
Usell, R.J., Jr. ; Smiley, S.A.
Author_Institution :
Burroughs Corporation, Micro Components Organization, 16701 West Bernardo Drive, San Diego, CA 92127
Abstract :
Methods to quantify mechanical strains in plastic encapsulated devices (PEDs) are described. Calculations of strain-producing tendencies of encapsulants from material properties and processes are given. Measurements of die strain as a function of encapsulant, processing, and environmental exposure are presented. Possible mechanisms for gap formation between chip and encapsulant during autoclave tests are described.
Keywords :
Capacitive sensors; Dielectric materials; Integrated circuit testing; Metallization; Passivation; Plastic integrated circuit packaging; Semiconductor device measurement; Strain measurement; Stress; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1981. 19th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1981.362976
