DocumentCode
2610476
Title
Reliability Study of Plastic Encapsulated Copper Lead Frame/Epoxy Die Attach Packaging System
Author
Howell, J.R.
Author_Institution
Microprocessor Products Group, Fairchild Camera and Instruments Corporation, 4800 Patrick Henry Drive, Santa Clara, CA 95051. (408) 987-9417
fYear
1981
fDate
29677
Firstpage
104
Lastpage
110
Abstract
This paper presents the evaluation methods used to appraise the reliability of plastic/copper lead frame packaging systems. A discussion of the copper/epoxy system, suspected failure mechanisms, tests designed to explore these mechanisms, and data developed during this study are presented. The data presented indicates the copper/epoxy system can meet or exceed the reliability of the Alloy 42 system.
Keywords
Bonding; Copper alloys; Costs; Gold alloys; Large scale integration; Lead; Microassembly; Plastic packaging; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1981. 19th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1981.362981
Filename
4208380
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