DocumentCode
2610712
Title
The Effects of Moisture on Multilayered Ceramic Top Brazed Flat Packs
Author
Drotman, Byrni ; Silva, Jim
Author_Institution
Jet Propulsion Laboratory, 4800 Oak Grove Drive, Pasadena, CA 91109. (213) 354-5622
fYear
1981
fDate
29677
Firstpage
188
Lastpage
192
Abstract
Recent moisture resistance tests of various multilayer top brazed ceramic flat packs have revealed a serious design deficiency. These flat packs which utilize a tungsten interconnect system, in the presence of high humidity, suffer a galvanic corrosion which anodically consumes the tungsten. This may ultimately produce an open circuit. The results indicate that the lead plating system does not adequately seal off the interface area where the tungsten stripe gresses from the inside of the package.
Keywords
Ceramics; Circuit testing; Corrosion; Galvanizing; Humidity; Integrated circuit interconnections; Moisture; Nonhomogeneous media; Seals; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1981. 19th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1981.362994
Filename
4208393
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