Title :
Lifetime acceleration model for HAST tests of a pHEMT process
Author :
Ersland, Peter ; Jen, Hei-Ruey ; Yang, Xinxing
Keywords :
Humidity; Life estimation; Life testing; PHEMTs; Plastics; Qualifications; Semiconductor device packaging; Stress; Switches; Temperature;
Conference_Titel :
GaAs Reliability Workshop, 2003. Proceedings
Print_ISBN :
0-7908-0104-3
DOI :
10.1109/GAASRW.2003.183764
