DocumentCode
2611038
Title
A Rapid Technique of Evaluating Thermally Induced Strains in Leadless Ceramic Chip Carriers Mounted to Polymeric Substrates
Author
DerMarderosian, Aaron ; Nadeau, Roger ; Gionet, Vincent
Author_Institution
Raytheon Company, Sudbury, Mass. 01776, (617) 443-9521
fYear
1982
fDate
30011
Firstpage
1
Lastpage
5
Abstract
A method has been developed which quantitatively evaluates the integrity of leadless ceramic chip carrier (LCCC) mounting schemes. This method utilizes strain gages and compares mounted and unmounted LCCC´s during temperature tests. This technique enables the designer to evaluate critical material parameters with a single temperature excursion.
Keywords
Capacitive sensors; Ceramics; Fatigue; Joining materials; Lead; Polymers; Soldering; Strain measurement; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location
San Diego, NV, USa
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1982.363015
Filename
4208417
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