DocumentCode

2611114

Title

Investigating thermal excursion failure mechanisms for flip chip

Author

Roesch, William J. ; Jittinorasett, Suwanna

fYear

2003

fDate

2003

Firstpage

107

Lastpage

116

Keywords

Acceleration; Assembly; Bonding; Copper; Failure analysis; Fatigue; Flip chip; Temperature; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

GaAs Reliability Workshop, 2003. Proceedings

Print_ISBN

0-7908-0104-3

Type

conf

DOI

10.1109/GAASRW.2003.183770

Filename

1397325