Title :
Investigating thermal excursion failure mechanisms for flip chip
Author :
Roesch, William J. ; Jittinorasett, Suwanna
Keywords :
Acceleration; Assembly; Bonding; Copper; Failure analysis; Fatigue; Flip chip; Temperature; Testing; Wire;
Conference_Titel :
GaAs Reliability Workshop, 2003. Proceedings
Print_ISBN :
0-7908-0104-3
DOI :
10.1109/GAASRW.2003.183770
