DocumentCode
2611248
Title
Investigation of charge loss mechanisms in planar and raised STI charge trapping flash memories
Author
Xia, Zhiliang ; Kim, Dae Sin ; Lee, Ju-Yul ; Lee, Keun-Ho ; Park, Young-Kwan ; Yoo, Moon-Hyun ; Chung, Chilhee
Author_Institution
Semicond. R&D Center, Samsung Electron. Co., Ltd., Hwasung, South Korea
fYear
2010
fDate
6-8 Sept. 2010
Firstpage
233
Lastpage
236
Abstract
A comprehensive simulation to investigate the charge loss mechanisms in planar and raised STI NAND-type charge trapping flash (CTF) memories with careful calibrations is present. The tunneling and silicon nitride trap transport with Poole-Frenkel (PF) effect are solved self-consistently and validated based on the experimental data including gate stacks leakage, program speed, and high temperature retention. Based on the programmed state, the high temperature retention is simulated and compared with the measurement data. In planar CTF, the vertical charge loss through tunneling layers and blocking layers are analyzed. The results show that the former is the dominant one. Finally, the charge loss in raised STI CTF is compared with that in planar CTF. The results show that the enhanced charge loss in raised STI CTF is induced by the lateral spreading and the non-uniform charge storage nearby the STI edge, especially in the narrow width (100nm) raised STI CTF.
Keywords
NAND circuits; Poole-Frenkel effect; calibration; electron traps; flash memories; silicon compounds; NAND-type charge trapping; Poole-Frenkel effect; SiN; blocking layers; calibration; charge loss mechanism; flash memories; gate stacks leakage; planar STI charge trapping; raised STI charge trapping; silicon nitride trap transport; tunneling layers; tunneling trap transport; Charge carrier processes; Electric fields; Logic gates; Silicon; Threshold voltage; Tunneling; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
Conference_Location
Bologna
ISSN
1946-1569
Print_ISBN
978-1-4244-7701-2
Electronic_ISBN
1946-1569
Type
conf
DOI
10.1109/SISPAD.2010.5604520
Filename
5604520
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