DocumentCode :
2611262
Title :
Future high density memories for computing applications: Device behavior and modeling challenges
Author :
Spadini, Gianpaolo ; Karpov, Ilya V. ; Kencke, David L.
Author_Institution :
NAND Solution Group, INTEL Corp., Santa Clara, CA, USA
fYear :
2010
fDate :
6-8 Sept. 2010
Firstpage :
223
Lastpage :
226
Abstract :
Memory elements existing and under research are compared for their suitability in computer memory applications. Cross point arrays of phase change elements with matched isolation devices are found to be particularly attractive and the challenge to model them is analyzed.
Keywords :
digital storage; phase change memories; computer memory; cross point arrays; device behavior; high density memories; phase change elements; Phase change materials; Phase change memory; Programming; Random access memory; Resistance; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
Conference_Location :
Bologna
ISSN :
1946-1569
Print_ISBN :
978-1-4244-7701-2
Electronic_ISBN :
1946-1569
Type :
conf
DOI :
10.1109/SISPAD.2010.5604521
Filename :
5604521
Link To Document :
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