• DocumentCode
    2611287
  • Title

    Impact of parameter variability on electromigration lifetime distribution

  • Author

    Ceric, H. ; de Orio, R.L. ; Selberherr, S.

  • fYear
    2010
  • fDate
    6-8 Sept. 2010
  • Firstpage
    217
  • Lastpage
    220
  • Abstract
    The interconnect scaling and the introduction of new processes and materials raise an issue of justifiability and applicability of phenomenological continuum-level models. The parameters of continuum-level electromigration models are averages over values which generally vary on microscopic and atomistic scale. Therefore it is necessary to investigate under which conditions these microscopic or atomistic spatial variations influence the validity of continuum models. Regarding both important parameters of continuum-level electromigration models, effective valence Z* and vacancy diffusivity, their variations depend on crystal orientation and the variations between bulk, grain boundaries, and interfaces. We apply the results of quantum mechanical calculations of the effective valence in order to parameterize the continuum electromigration model and subsequently investigate the impact of parameter variation on the variability of the electromigration behavior.
  • Keywords
    copper; crystal orientation; electromigration; grain boundaries; Cu; crystal orientation; effective valence; electromigration lifetime distribution; grain boundaries; interconnect scaling; parameter variability; phenomenological continuum-level models; quantum mechanical calculations; vacancy diffusivity; Copper; Electromigration; Force; Grain boundaries; Microscopy; Microstructure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
  • Conference_Location
    Bologna
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-7701-2
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2010.5604523
  • Filename
    5604523