• DocumentCode
    2611353
  • Title

    Strain effects on hole current in silicon nanowire FETs

  • Author

    Minari, Hideki ; Kitayama, Tatsuro ; Yamamoto, Masahiro ; Mori, Nobuya

  • Author_Institution
    Div. of Electr., Electron. & Inf. Eng., Osaka Univ., Suita, Japan
  • fYear
    2010
  • fDate
    6-8 Sept. 2010
  • Firstpage
    207
  • Lastpage
    210
  • Abstract
    Hole transport simulation based on the nonequilibrium Green´s function and tight-binding formalism has been performed for strained Si nanowire FETs with a diameter of 1.5nm and 2.5 nm. Simulation results show that for Si nanowire FETs with a diameter of 2.5 nm, the compressive strain enhances the ballistic hole current, while the tensile strain gives opposite results. For Si nanowire FETs with a diameter of 1.5 nm, the ballistic hole current hardly depends on the strain magnitude.
  • Keywords
    Green´s function methods; compressive strength; elemental semiconductors; field effect transistors; nanowires; silicon; tensile strength; Si; compressive strain; hole current; hole transport simulation; nonequilibrium Green function; silicon nanowire FET; size 1.5 nm; size 2.5 nm; strain effects; tensile strain; tight-binding formalism; Dispersion; FETs; Logic gates; Nanoscale devices; Silicon; Tensile strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
  • Conference_Location
    Bologna
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-7701-2
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2010.5604528
  • Filename
    5604528