• DocumentCode
    2611463
  • Title

    Variability in nano-scale intrinsic silicon-on-thin-box MOSFETs (SOTB MOSFETs)

  • Author

    Yang, Yunxiang ; Du, Gang ; Han, Ruqi ; Liu, Xiaoyan

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2010
  • fDate
    6-8 Sept. 2010
  • Firstpage
    183
  • Lastpage
    186
  • Abstract
    Lightly doped or even intrinsic channel can be used in SOTB MOSFETs and therefore very Low RDF (random dopant flunctuation) can be expected in such devices. In this work, we systematically investigated the influences of the intrinsic parameter fluctuations, including LER (line-edge-roughness), STV (silicon thickness variation) and WFV (metal-gate work-function variation), on 20nm-gate intrinsic SOTB MOSFETs with GP (ground plane). Conditions of SOTB without GP and with PGP (partial ground plane) are also simulated for comparison. Our results show that LER dominates fluctuations in n-SOTB while LER and WFV dominate that in p-SOTB. Introduction of GP can effectively reduce LER- and STV-induced variations of Vtsat, DIBL and Ion with a slightly sacrifice of σLog(Ioff) while it has little effect on WFV-induced variations. A detailed design of PGP is desired from the perspective of variability-aware optimization.
  • Keywords
    MOSFET; nanotechnology; ground plane; intrinsic parameter fluctuations; line-edge-roughness; metal-gate work-function variation; nano-scale intrinsic silicon-on-thin-box MOSFET; random dopant flunctuation; silicon thickness variation; size 20 nm; variability-aware optimization; Doping; Fluctuations; Logic gates; MOSFETs; Semiconductor process modeling; Silicon; Threshold voltage; Intrinsic channel; SOTB; TCAD; ground plane; intrinsic; parameter fluctuations; variability; variability aware design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
  • Conference_Location
    Bologna
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-7701-2
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2010.5604533
  • Filename
    5604533