Precision VLSI Cross-Sectioning and Staining

This paper describes a unique and novel approach to VLSI cross-sectioning. It incorporates the discipline needed to achieve cross-sectioning to any given area on an integrated circuit to within ± 0.2 microns with a greater than 90% confidence level. Coupled to the precision cross-sectioning technique a stain was formulated and refined to enhance the observation by scanning electron microscopy of sub-surface, sub-micron features. This provides the failure analyst a powerful technique to assist in the analysis of complex VLSI devises.