Title :
A New Accelerated Test Method for Moisture Resistance of Plastic Encapsulated Lsis
Author :
Yoshida, T. ; Takahashi, T. ; Koyama, S.
Author_Institution :
Production Engineering Research Laboratory, Hitachi, Ltd., 292 Yoshida-machi, Totsuka-ku, Yokohama 244, Japan
Abstract :
A new test method, which reduces the test time for evaluating aluminum corrosion in the bonding pad area of plastic encapsulated LSI, has been developed. The main feature of this method is to pressurize LSI packages in salt water before performing the temperature humidity test. An acceleration factor of 6 was obtained with reference to a simple temperature humidity test.
Keywords :
Aluminum; Bonding; Corrosion; Humidity; Large scale integration; Life estimation; Moisture; Plastics; Temperature; Testing;
Conference_Titel :
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location :
San Diego, NV, USa
DOI :
10.1109/IRPS.1982.361941
