Title :
A Contribution of Polymer Die Attach Systems to the Reliability of Plastic Encapsulated Integrated Circuits
Author :
Manchester, Kenneth E. ; Bird, Donald W. ; Charest, Henry
Author_Institution :
Semiconductor Division, Sprague Electric Company, Worcester, Mass. 01606
Abstract :
A systematic investigation into the performance of plastic encapsulated integrated circuits during humidity testing has been conducted. A failure mechanism has been identified for devices assembled on copper lead frames and traced to the silver loaded polymer used for attaching the I.C. to the frame. Reliability data are presented for devices assembled with different die attach systems.
Keywords :
Assembly; Circuit testing; Failure analysis; Humidity; Integrated circuit reliability; Integrated circuit testing; Microassembly; Plastics; Polymers; System testing;
Conference_Titel :
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location :
San Diego, NV, USa
DOI :
10.1109/IRPS.1982.361942
