Title :
Assurance Procedures for the Control of Electromigration
Author :
Bart, John J. ; Walter, Martin
Author_Institution :
Reliability and Compatibility Division, Rome Air Development Center, Griffiss AFB NY
Keywords :
Aluminum; Conducting materials; Conductive films; Conductors; Current density; Electromigration; Failure analysis; Metallization; Microstructure; Very large scale integration;
Conference_Titel :
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location :
San Diego, NV, USa
DOI :
10.1109/IRPS.1982.361946