Scheduling LED Packaging and Testing Operations on Die Bonder

Die bonder is an important process operation but also often the cause of bottlenecks in LED packaging and testing factories. Therefore, the development of an effective scheduling method to minimize makespan in this die bonder process is essential and difficult. In the LED(Light-emitting diode) packaging and testing scheduling problem (LEDPTSP), jobs are clustered by their product types, which must be processed on identical parallel die bounder machines. The setup times for two consecutive jobs between different product types in the machines are sequence-dependent. In this paper, the LEDPTSP is formulated as a integer linear programming model and use Cplex to solve the real- world case.