Title :
AES/ESCA/SEM/EDX Studies of Die Bond Materials and Interfaces
Author :
Li, Tom P.L. ; Zigler, E.L. ; Hillyer, D.E.
Author_Institution :
MARTIN MARIETTA ORLANDO AEROSPACE, ORLANDO, FLORIDA
Keywords :
Aerospace materials; Bonding; Failure analysis; Gold; Microassembly; Microelectronics; Packaging; Preforms; Silicon; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1984. 22nd Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1984.362039
