DocumentCode

2613307

Title

Initial Wetting and Reaction Sequences in Soldering

Author

Walker, G.A. ; DeHaven, P.W.

Author_Institution

IBM Corporation, East Fishkill Facility, Building 300-41C, Hopewell Junction, New York 12533

fYear

1984

fDate

30773

Firstpage

181

Lastpage

184

Keywords

Copper; Gold; Intermetallic; Kinetic theory; Monitoring; Soldering; Strips; Substrates; Tin; X-ray diffraction;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1984. 22nd Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1984.362041

Filename

4208565