• DocumentCode
    2613612
  • Title

    Electromigration Evaluation - MTF Modeling and Accelerated Testing

  • Author

    Burkett, T.A. ; Miller, R.L.

  • Author_Institution
    Harris Semiconductor, P. O. Box 883, Melbourne. FL 32901-0101
  • fYear
    1984
  • fDate
    30773
  • Firstpage
    264
  • Lastpage
    272
  • Abstract
    Fail times and activation energies were determined to vary widely for different metal compositions. General results indicate that temperature, current density and grain size are the most dominant factors that affect electromigration behavior for the various metal compositions. The technique of using changes in metal stripe resistance to predict the time of failure was evaluated.
  • Keywords
    Circuit testing; Conductors; Current density; Electromigration; Life estimation; Ovens; Passivation; Sputtering; Temperature; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1984. 22nd Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1984.362057
  • Filename
    4208581
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2613612